The benefits of via-in-pad designs are well documented. From reduction of inductance to increased density, via-in-pad has become an essential tool for designers when navigating the routing challenges of fine pitch array packages that have become mainstays in today’s BOMs but there are trade-offs that must be considered. The basic concept is elegant. The via-in-pad [] The post PCB design tips: Via-in-pad appeared first on NCAB Group.
COMMON DESIGN PROBLEMS REGARDING HDI PRODUCTION PROBLEMS DEPENDING ON THIS BEST SOLUTION Too tight demands on the thickness of overplating of plugged vias. (POFV or VIPPO) Affects the flow of the process, at a reasonable thickness of the overplating all t
prejsť na článokIn issue no 3 of In Focus NCAB Group´s newsletter, we dig deeper into high-tech PCBs. As an appetizer, we will already now give you some useful designtips regarding HDIs. COMMON DESIGN PROBLEMS REGARDING HDI PRODUCTION PROBLEMS DEPENDING ON THIS BEST SOL
prejsť na článokAs a designer, you now have to think about more than just the software you design on. In order to ensure that you have a robust design you have to understand how to design for manufacturability (DFM), how to design for the environment (DFE), how to design
prejsť na článokThe words packaging, Zero waste, circular economy ... thank God are changing from a marketing pull to serious topics not only in the official measures of states and organizations. They become a real feature of business strategies of entrepreneurs. From th
prejsť na článokThe post Holiday season app tips appeared first on APATrans.
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